| Age | Commit message (Collapse) | Author |
|---|
|
|
|
* [action/ci] pkgs --update-force instead of pkgs --update
* Update bsp_buildings.yml
* l4 单独拉出来
|
|
* [bsp][wch]to clear the serial of ch32v20x
* [bsp][wch] move ch32v20x sdk to pkg
* [ci] add ch32v208 bsp
* [bsp][wch] update readme
|
|
adaptation
|
|
* [bsp][wch] move ch32v307 sdk to package
* [bsp][wch] move ch32v307 sdk to package
* [bsp][wch] use a fixed version
* [bsp][wch]fix: ch32v307v-r1 build
* [bsp][wch] add yd board to ci
* [bsp][wch] revert toolchain path
|
|
|
|
support FRDM-MCXA156
Co-authored-by: shannon <[email protected]>
|
|
[bsp][mm32f526x] 1.add a bsp for mm32f526x;
|
|
* Add an STM32H730 bsp
|
|
|
|
Revert "[action] add cvitek/c906_little ci (#9901)"
This reverts commit 969e0e01ef603d3929a186e8bd03f3657ec8227c.
|
|
* [action] add cvitek/c906_little ci
* Update bsp_buildings.yml
* Update rtconfig.py
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
* [ci]fix fm33lc026 yc3121-pos build issue
* [ci]rm airm2m/air105
|
|
|
|
|
|
* [bsp][w60x][rsoc] Fix compilation issues with bsp of w60x
* [bsp][w60x][rsoc] Fix compilation issues with bsp of w60x
|
|
|
|
|
|
|
|
|
|
|
|
canfd)
|
|
修复scons编译问题并添加ci
|
|
- added hpm6e00evk support
Signed-off-by: Fan YANG <[email protected]>
|
|
|
|
|
|
(#9185)
* 统一tools中env相关的接口到env_utility.py文件，并同步调整ci
* 移除非本提交的文件
---------
Co-authored-by: Meco Man <[email protected]>
|
|
|
|
* -以ev_hc32f4a0_lqfp176为模板进行修改
* -修改对应引脚
* -更新readme
* -update readme
* -添加 lckfb-hc32f4a0-lqfp100
|
|
|
|
hpm_sdk
- added new boards: hpm5300evk, hpm5301evklite and hpm6800evk
- upgaded hpm_sdk
- driver updates and bugfixes
- add hpmicro BSPs to CI
Signed-off-by: Fan YANG <[email protected]>
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
