u-boot.git/Makefile, branch v2020.01-rc4

Prepare v2020.01-rc4

2019-12-03T03:09:27Z

Signed-off-by: Tom Rini

ARM: socfpga: Introduce u-boot-with-nand-spl.sfp target

2019-11-25T12:12:56Z

The NAND devices with 128 kiB erase blocks require extra 64 kiB padding between each SPL image. Generate U-Boot image with such a padding using this new target. Signed-off-by: Marek Vasut Cc: Chin Liang See Cc: Dalon Westergreen Cc: Dinh Nguyen Cc: Ley Foon Tan Cc: Simon Goldschmidt Cc: Tien Fong Chee Reviewed-by: Ley Foon Tan

Prepare v2020.01-rc3

2019-11-19T02:31:49Z

Signed-off-by: Tom Rini

Merge tag 'dm-pull-14nov19' of git://git.denx.de/u-boot-dm

2019-11-18T02:15:23Z

Add OP-TEE test swuit Fix patman cc_file output Minor sandbox/pinctrl changes

tests: add OP-TEE test suite

2019-11-14T13:09:34Z

OP-TEE can get supplied with a devicetree and will then insert its firmware node and reserved-memory sections into it. As this devicetree often is not the one supplied to a later loaded kernel, a previous commit added functionality to transfer these nodes onto that new devicetree. To make sure this functionality stays intact, also add a test for the transfer functionality. Signed-off-by: Heiko Stuebner Reviewed-by: Simon Glass

efi_loader: support building UEFI binaries on sandbox

2019-11-12T22:13:54Z

On the sandbox the UEFI binaries must match the host architectures. Adjust the Makefiles. Provide the PE/COFF header and relocation files. Allow building helloworld.efi on the sandbox. Signed-off-by: Heinrich Schuchardt

Prepare v2020.01-rc2

2019-11-12T02:01:10Z

Signed-off-by: Tom Rini

usb: Add Cadence USB3 host and gadget driver

2019-11-06T23:24:59Z

Add support for USB3 host and gadget driver. This is a direct sync of Linux kernel Cadence USB stack that from v5.4-rc1 release. Driver has been modified so that it compiles without errors against U-Boot code base. Features not required for U-Boot such as scatter-gather DMA and OTG interrupt handling has been dropped. Signed-off-by: Jean-Jacques Hiblot [jjhiblot@ti.com: Add PHY support] Signed-off-by: Vignesh Raghavendra

Makefile: fix dependency for imx targets

2019-11-06T14:22:32Z

imx targets are defined in arch/arm/mach-imx/Makefile. Some of them are dependent on targets defined in main Makefile. For the Makefile in arch/arm/mach-imx this targets must be finished before the imx targets are build, if not you get for example the error: make -f /home/hs/abb/mainlining/u-boot/scripts/Makefile.build obj=arch/arm/mach-imx u-boot-dtb.imx make[2]: *** No rule to make target 'u-boot-fit-dtb.bin', needed by 'u-boot-dtb.imx'. Stop. make[1]: *** [/home/hs/abb/mainlining/u-boot/Makefile:1123: u-boot-dtb.imx] Error 2 make[1]: *** Waiting for unfinished jobs.... make[1]: Leaving directory '/work/hs/compile/u-boot/aristainetos2_defconfig' make: *** [Makefile:148: sub-make] Error 2 compile failed In above case of CONFIG_MULTI_DTB_FIT is defined, the u-boot-dtb.imx is dependent on the u-boot-fit-dtb.bin which may is not build yet ... I could reproduce this error on a travis build also if I build an out-of-tree build on a local machine with a build directory on a "slow" slow storage device. If building the same source target with a build dir on a fast storage device, the build works. I found no solution to tell the arch/arm/mach-imx/Makefile to find the targets in main Makefile, if there is a way this would be the better fix. I solved it by adding a IMX_DEPS var, which holds a list of main u-boot targets, which must be finished, before calling imx targets and fixed the build for imx targets which enabled CONFIG_MULTI_DTB_FIT. I think it is just luck, that imx targets with CONFIG_OF_SEPARATE enabled build, because the u-boot-dtb.imx target depends on u-boot-dtb.bin which gets build early enough before starting with u-boot-dtb.imx. May this targets should be fixed too. Signed-off-by: Heiko Schocher Reviewed-by: Tom Rini

spl: Add a size check for TPL

2019-11-02T23:20:27Z

We have the ability to enforce a maximum size for SPL but not yet for TPL. Add a new option for this. Document the size check macro while we are here. Signed-off-by: Simon Glass Reviewed-by: Bin Meng