u-boot.git/drivers/mtd, branch v2024.01-rc2

bootstd: BOOTDEV_SPI_FLASH requires BOOTSTD

2023-11-01T16:26:44Z

Compiling sandbox_defconfig with CONFIG_BOOTSTD=n fails: /usr/bin/ld: drivers/mtd/spi/sf_bootdev.o: in function `sf_get_bootflow': /drivers/mtd/spi/sf_bootdev.c:43:(.text+0x96): undefined reference to `bootmeth_set_bootflow' Add the missing Kconfig dependency. Fixes: Fixes: 0c1f4a9fb13a ("bootstd: Add a SPI flash bootdev") Signed-off-by: Heinrich Schuchardt Reviewed-by: Simon Glass

Kconfig: Remove all default n/no options

2023-10-30T19:32:49Z

Similar change was done by commit b4c2c151b14b ("Kconfig: Remove all default n/no options") and again sync is required. default n/no doesn't need to be specified. It is default option anyway. Signed-off-by: Michal Simek Reviewed-by: Svyatoslav Ryhel # tegra Reviewed-by: Tom Rini Reviewed-by: Angelo Dureghello

mtd: nand: raw: rockchip_nfc: add NAND_SKIP_BBTSCAN option

2023-10-24T07:55:16Z

On Rockchip SoCs the first boot stages are written on NAND with help of manufacturer software that uses a different format then the MTD framework. Skip the automatic BBT scan with the NAND_SKIP_BBTSCAN option to be able to pass the driver probe function and to let the original data unchanged. Signed-off-by: Johan Jonker Reviewed-by: Kever Yang

mtd: spi-nor: Add support for XMC XM25QU128C

2023-10-24T07:55:16Z

Add support for XMC XM25QU128C (128M-bit) Serial Flash memory. Used on the Xunlong Orange Pi 3B, 5 and 5 Plus boards. Datasheet: https://www.xmcwh.com/uploads/806/XM25QU128C_Ver2.0.pdf Signed-off-by: Ricardo Pardini [jonas@kwiboo.se: update commit message] Signed-off-by: Jonas Karlman Reviewed-by: Kever Yang

mtd: spinand: winbond: add Winbond W25N02KV flash support

2023-10-13T08:49:07Z

Add support of Winbond W25N02KV flash Signed-off-by: Mikhail Kshevetskiy Reviewed-by: Frieder Schrempf Signed-off-by: Miquel Raynal Link: https://lore.kernel.org/linux-mtd/20221010105110.446674-2-mikhail.kshevetskiy@iopsys.eu Signed-off-by: Frieder Schrempf (U-Boot port) Link: https://lore.kernel.org/all/20230110115843.391630-5-frieder@fris.de Signed-off-by: Dario Binacchi

mtd: spinand: winbond: fix flash identification

2023-10-13T08:49:07Z

Winbond uses 3 bytes to identify flash: vendor_id, dev_id_0, dev_id_1, but current driver uses only first 2 bytes of it for devices identification. As result Winbond W25N02KV flash (id_bytes: EF, AA, 22) is identified as W25N01GV (id_bytes: EF, AA, 21). Fix this by adding missed identification bytes. Signed-off-by: Mikhail Kshevetskiy Reviewed-by: Frieder Schrempf Signed-off-by: Miquel Raynal Link: https://lore.kernel.org/linux-mtd/20221010105110.446674-1-mikhail.kshevetskiy@iopsys.eu Signed-off-by: Frieder Schrempf (U-Boot port) Link: https://lore.kernel.org/all/20230110115843.391630-4-frieder@fris.de Signed-off-by: Dario Binacchi

mtd/spinand: sync supported devices with linux-5.15.43

2023-10-13T08:49:07Z

This adds more supported spinand devices from the Linux kernel implementation. This does not include the latest kernel implementation as this would require a substantial amount of extra work due to the missing ECC engine abstraction layer in U-Boot. Signed-off-by: Mikhail Kshevetskiy Signed-off-by: Frieder Schrempf (commit message) Link: https://lore.kernel.org/all/20230110115843.391630-3-frieder@fris.de Signed-off-by: Dario Binacchi

mtd/spinand: sync core spinand code with linux-5.10.118

2023-10-13T08:49:07Z

This brings us closer to the current Linux kernel implementation of the spinand core and makes backporting features and fixes easier. This does not include the latest kernel implementation as this would require a substantial amount of extra work due to the missing ECC engine abstraction layer in U-Boot. Signed-off-by: Mikhail Kshevetskiy Signed-off-by: Frieder Schrempf (add commit message) Link: https://lore.kernel.org/all/20230110115843.391630-2-frieder@fris.de Signed-off-by: Dario Binacchi

mtd/spinand: rework detect procedure for different READ_ID operation

2023-10-13T08:49:07Z

Currently there are 3 different variants of read_id implementation: 1. opcode only. Found in GD5FxGQ4xF. 2. opcode + 1 addr byte. Found in GD5GxGQ4xA/E 3. opcode + 1 dummy byte. Found in other currently supported chips. Original implementation was for variant 1 and let detect function of chips with variant 2 and 3 to ignore the first byte. This isn't robust: 1. For chips of variant 2, if SPI master doesn't keep MOSI low during read, chip will get a random id offset, and the entire id buffer will shift by that offset, causing detect failure. 2. For chips of variant 1, if it happens to get a devid that equals to manufacture id of variant 2 or 3 chips, it'll get incorrectly detected. This patch reworks detect procedure to address problems above. New logic do detection for all variants separatedly, in 1-2-3 order. Since all current detect methods do exactly the same id matching procedure, unify them into core.c and remove detect method from manufacture_ops. This is a rework of Chuanhong Guo patch submitted to linux kernel Signed-off-by: Mikhail Kshevetskiy Signed-off-by: Frieder Schrempf Link: https://lore.kernel.org/all/20230110115843.391630-1-frieder@fris.de Signed-off-by: Dario Binacchi

Merge branch 'next'

2023-10-02T14:55:44Z

Signed-off-by: Tom Rini