The datasheet can be found here:
https://www.esmt.com.tw/upload/pdf/ESMT/datasheets/EN25Q80B_Ver.E.pdf

Signed-off-by: Frieder Schrempf <frieder.schrempf@kontron.de>
Reviewed-by: Fabio Estevam <festevam@gmail.com>

First set of u-boot-at91 features for the 2024.04 cycle:

This set includes some DT alignments and solves a compile issue for
custom nand defconfigs.

This function is a no-op. Remove it.

Signed-off-by: Sean Anderson <seanga2@gmail.com>
Link: https://lore.kernel.org/r/20231216193843.2463779-3-seanga2@gmail.com

Infineon(Cypress) S28HS02GT is 1.8V, 2Gb (256MB) NOR Flash memory with
Octal interface. It is a dual-die package parts and has same features
with existing S28 series.

Signed-off-by: Takahiro Kuwano <Takahiro.Kuwano@infineon.com>
Reviewed-by: Dhruva Gole <d-gole@ti.com>
Reviewed-by: Jagan Teki <jagan@amarulasolutions.com>

Enabling Octal DTR mode in multi-die package parts requires reister setup
for each die. That can be done by simple for-loop. write_enable() takes
effect to all die at once so we can call it before the loop. Besides we
can replace spi_mem_exec_op() calls with spansion_read/write_any_reg().
And finally, we must mask CFR2V[7:4] when changing dummy cycles, as
CFR2V[7] indicates current addressing mode and that should be 1 (4-byte
address mode) for multi-die package parts.

Signed-off-by: Takahiro Kuwano <Takahiro.Kuwano@infineon.com>
Reviewed-by: Jagan Teki <jagan@amarulasolutions.com>

s28hx_t_post_bfpt_fixup() fixes erase opcode, erase size, and page size.
s25_post_bfpt_fixup() is doing same thing including multi-die support.
We can consolidate s28hx_t_post_bfpt_fixup() and s25_post_bfpt_fixup()
into one named s25_s28_post_bfpt_fixup().

In s25_s28_post_bfpt_fixup(), set_4byte() is called to force the device to
be 4-byte addressing mode. In S28HS02GT datasheet, the B7 opcode is missing
but it works actually (confirmed).

Signed-off-by: Takahiro Kuwano <Takahiro.Kuwano@infineon.com>
Reviewed-by: Jagan Teki <jagan@amarulasolutions.com>

s28hx_t_setup() only checks sector layout setting. To support multi-die
package parts like S28HS02GT, it needs to check device size and assign
ready() hook for multi-die package parts. These are covered in s25_setup()
so we can consolidate s28hx_t_setup() and s25_setup() into one named
s25_s28_setup().

spi_nor_wait_till_ready() at the beginning of s28hx_t_setup() can be
removed since there is no op that makes device busy state before setup.

Signed-off-by: Takahiro Kuwano <Takahiro.Kuwano@infineon.com>
Reviewed-by: Jagan Teki <jagan@amarulasolutions.com>

s25_mdp_ready() handles status polling for multi-die package parts that
requires to read and check status register for each die. To support
S28HS02GT(dual-die package with Octal DTR support), rename function and
use nor->rdsr_dummy in octal DTR mode.

Signed-off-by: Takahiro Kuwano <Takahiro.Kuwano@infineon.com>
Reviewed-by: Jagan Teki <jagan@amarulasolutions.com>

Infineon(Cypress) S28Hx-T family does not support legacy CLSR(0x30) opcode.
Instead, it supports CLPEF(0x82) which has the same functionality as CLSR.
spansion_sr_ready() is for multi-die package parts including S28HS02GT, so
we need to use CLPEF instead of CLSR.

This change does not affect to S25x02GT which uses spansion_sr_ready() as
S25Hx-T family also supports CLPEF(0x82) as well as CLSR(0x30).

Signed-off-by: Takahiro Kuwano <Takahiro.Kuwano@infineon.com>
Reviewed-by: Jagan Teki <jagan@amarulasolutions.com>

In Infineon multi-die package parts, we need to use Read Any Register op
to read status register in 2nd or further die. Infineon S28HS02GT is
dual-die package and supports Octal DTR interface. To support this,
spansion_read_any_reg() needs to be reworked. Implementation is similar
to existing read_sr() that already supports Octal DTR mode.

Signed-off-by: Takahiro Kuwano <Takahiro.Kuwano@infineon.com>
Reviewed-by: Jagan Teki <jagan@amarulasolutions.com>