At the moment a mixture of ifdef(CONFIG_IS_ENABLED) and
CONFIG_IS_ENABLED(SPI_FLASH_BAR) is used in the spi-nor framework.
This leads to misbehaviour in the SPL as there is no Kconfig option
CONFIG_SPL_SPI_FLASH_BAR. This commit standardizes the use of
CONFIG_SPI_FLASH to get SPLs that load U-Boot proper from the
SPI flash to work again.

Fixes: 9bb02f7 (mtd: spi-nor: Fix the spi_nor_read() when config SPI_STACKED_PARALLEL is enabled)
Signed-off-by: Bernhard Messerklinger <bernhard.messerklinger@br-automation.com>

The SPI_ADVANCE description does not explain what the switch does.
It does not have anything to do with any advanced functionality, it
only gates off support for stacked and parallel SPI NORs. Rename the
Kconfig symbol, update description, and move it right next to Xilinx
hardware as it seems to be specific to this hardware. Make sure the
symbol is also protected by if DM_SPI in Kconfig.

Fixes: 5d40b3d384dc ("mtd: spi-nor: Add parallel and stacked memories support")
Signed-off-by: Marek Vasut <marek.vasut+renesas@mailbox.org>

Move the SR3 bit definition in the right place. Fix
what is likely a rebase artifact. No functional change.

Fixes: 215f1d5794c6 ("mtd: spi-nor: Clear Winbond SR3 WPS bit on boot")
Signed-off-by: Marek Vasut <marex@denx.de>

Some flashes like the Infineon SEMPER NOR flash family use ECC. Under
this ECC scheme, multi-pass writes to an ECC block is not allowed.
In other words, once data is programmed to an ECC block, it can't be
programmed again without erasing it first.

Upper layers like file systems need to be given this information so they
do not cause error conditions on the flash by attempting multi-pass
programming. This can be done by setting 'writesize' in 'struct
mtd_info'.

Set the default to 1 but allow flashes to modify it in fixup hooks. If
more flashes show up with this constraint in the future it might be
worth it to add it to 'struct flash_info', but for now increasing its
size is not worth it.

This patch replicates the following upstream linux commit:
afd473e85827 ("mtd: spi-nor: core: Allow flashes to specify MTD writesize")

Acked-by: Tudor Ambarus <tudor.ambarus@linaro.org>
Signed-off-by: Takahiro Kuwano <Takahiro.Kuwano@infineon.com>

Some Winbond SPI NORs have special SR3 register which is
used among other things to control whether non-standard
"Individual Block/Sector Write Protection" (WPS bit)
locking scheme is activated. This non-standard locking
scheme is not supported by either U-Boot or Linux SPI
NOR stack so make sure it is disabled, otherwise the
SPI NOR may appear locked for no obvious reason.

This SR3 WPS appears e.g. on W25Q16FW which has the same ID as
W25Q16DW, but the W25Q16DW does not implement the SR3 WPS bit.

Signed-off-by: Marek Vasut <marex@denx.de>

In parallel mode, the current implementation assumes that a maximum of
two flashes are connected. The QSPI controller splits the data evenly
between both the flashes so, both the flashes that are connected in
parallel mode should be identical.
During each operation SPI-NOR sets 0th bit for CS0 & 1st bit for CS1 in
nor->flags.

In stacked mode the current implementation assumes that a maximum of two
flashes are connected and both the flashes are of same make but can
differ in sizes. So, except the sizes all other flash parameters of both
the flashes are identical

Spi-nor will pass on the appropriate flash select flag to low level
driver, and it will select pass all the data to that particular flash.

Write operation in parallel mode are performed in page size * 2 chunks as
each write operation results in writing both the flashes. For doubling
the address space each operation is performed at addr/2 flash offset,
where addr is the address specified by the user.

Similarly for read and erase operations it will read from both flashes,
so size and offset are divided by 2 and send to flash.

Adding the config option SPI_ADVANCE for non SPL code.

Signed-off-by: Ashok Reddy Soma <ashok.reddy.soma@amd.com>
Signed-off-by: Venkatesh Yadav Abbarapu <venkatesh.abbarapu@amd.com>

Enabling Octal DTR mode in multi-die package parts requires reister setup
for each die. That can be done by simple for-loop. write_enable() takes
effect to all die at once so we can call it before the loop. Besides we
can replace spi_mem_exec_op() calls with spansion_read/write_any_reg().
And finally, we must mask CFR2V[7:4] when changing dummy cycles, as
CFR2V[7] indicates current addressing mode and that should be 1 (4-byte
address mode) for multi-die package parts.

Signed-off-by: Takahiro Kuwano <Takahiro.Kuwano@infineon.com>
Reviewed-by: Jagan Teki <jagan@amarulasolutions.com>

Infineon(Cypress) S28Hx-T family does not support legacy CLSR(0x30) opcode.
Instead, it supports CLPEF(0x82) which has the same functionality as CLSR.
spansion_sr_ready() is for multi-die package parts including S28HS02GT, so
we need to use CLPEF instead of CLSR.

This change does not affect to S25x02GT which uses spansion_sr_ready() as
S25Hx-T family also supports CLPEF(0x82) as well as CLSR(0x30).

Signed-off-by: Takahiro Kuwano <Takahiro.Kuwano@infineon.com>
Reviewed-by: Jagan Teki <jagan@amarulasolutions.com>

s25_erase_non_uniform() and s28hx_t_erase_uniform() support hybrid sector
layout (32 x 4KB sectors overlaid at bottom address) and doing same thing.
Consolidate them into single helper named s25_s28_erase_non_uniform().

Signed-off-by: Takahiro Kuwano <Takahiro.Kuwano@infineon.com>
Reviewed-by: Jagan Teki <jagan@amarulasolutions.com>

Some macro definitions used in Infineon(Cypress) S25 and S28 series are
redundant and some have inconsistent prefix. This patch removes
redundant ones and renames some to have same prefix as others.

Signed-off-by: Takahiro Kuwano <Takahiro.Kuwano@infineon.com>
Reviewed-by: Jagan Teki <jagan@amarulasolutions.com>