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The Radxa ZERO 3W/3E is an ultra-small, high-performance single board
computer based on the Rockchip RK3566, with a compact form factor and
rich interfaces.
Implement rk_board_late_init() to set correct fdtfile env var and
board_fit_config_name_match() to load correct FIT config based on what
board is detected at runtime so a single board target can be used for
both board models.
Features tested on a ZERO 3W 8GB v1.11:
- SD-card boot
- eMMC boot
- USB gadget
- USB host
Features tested on a ZERO 3E 4GB v1.2:
- SD-card boot
- Ethernet
- USB gadget
- USB host
Signed-off-by: Jonas Karlman <[email protected]>
Tested-by: FUKAUMI Naoki <[email protected]>
Reviewed-by: Kever Yang <[email protected]>
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What model of Radxa ZERO 3W/3E board can be identified using ADC at
runtime, add a Kconfig symbol to allow use of ADC in SPL.
This will be used to identify board model in SPL to allow loading
correct FIT configuration and FDT for U-Boot proper at SPL phase.
Signed-off-by: Jonas Karlman <[email protected]>
Reviewed-by: Kever Yang <[email protected]>
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Add names to the pins of the general-purpose expansion header as given
in the Radxa documentation[1] following the conventions in the kernel[2]
to make it easier for users to correlate pins with functions when using
utilities such as 'gpioinfo'.
[1] https://docs.radxa.com/en/zero/zero3/hardware-design/hardware-interface
[2] https://www.kernel.org/doc/Documentation/devicetree/bindings/gpio/gpio.txt
Signed-off-by: Trevor Woerner <[email protected]>
Link: https://lore.kernel.org/r/[email protected]
Signed-off-by: Heiko Stuebner <[email protected]>
[ upstream commit: f7c742cbe664ebdedc075945e75443683d1175f7 ]
(cherry picked from commit 8b26cf42ba0c74a9c86cebe591a9195f75151d97)
Signed-off-by: Jonas Karlman <[email protected]>
Reviewed-by: Kever Yang <[email protected]>
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align with other Radxa products.
- mmc0 is eMMC
- mmc1 is microSD
for ZERO 3E, there is no eMMC, but aliases should start at 0, so mmc0
is microSD as exception.
Fixes: 1a5c8d307c83 ("arm64: dts: rockchip: Add Radxa ZERO 3W/3E")
Signed-off-by: FUKAUMI Naoki <[email protected]>
Changes in v3:
- fix syntax error in rk3566-radxa-zero-3e.dts
Changes in v2:
- microSD is mmc0 instead of mmc1 for ZERO 3E
Link: https://lore.kernel.org/r/[email protected]
Signed-off-by: Heiko Stuebner <[email protected]>
[ upstream commit: 060c1950037e4c54ca4d8186a8f46269e35db901 ]
(cherry picked from commit 8324bc7493e4088013c62bc41f49d6d181575493)
Signed-off-by: Jonas Karlman <[email protected]>
Reviewed-by: Kever Yang <[email protected]>
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The Radxa ZERO 3W/3E is an ultra-small, high-performance single board
computer based on the Rockchip RK3566, with a compact form factor and
rich interfaces.
The ZERO 3W and ZERO 3E are basically the same size and model, but
differ only in storage and network interfaces.
- eMMC (3W)
- SD-card (both)
- Ethernet (3E)
- WiFi/BT (3W)
Add initial support for eMMC, SD-card, Ethernet, HDMI and USB.
Signed-off-by: Jonas Karlman <[email protected]>
Link: https://lore.kernel.org/r/[email protected]
Signed-off-by: Heiko Stuebner <[email protected]>
[ upstream commit: 1a5c8d307c83c808a32686ed51afb4bac2092d39 ]
(cherry picked from commit 1476c5882f8a47b6f0f895c6424dacf6334487ae)
Signed-off-by: Jonas Karlman <[email protected]>
Reviewed-by: Kever Yang <[email protected]>
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The Radxa ROCK 3B is a single-board computer based on the Pico-ITX form
factor (100mm x 75mm). Two versions of the ROCK 3B exists, a community
version based on the RK3568 SoC and an industrial version based on the
RK3568J SoC.
Features tested on ROCK 3B 8GB v1.51 (both variants):
- SD-card boot
- eMMC boot
- SPI Flash boot
- Ethernet
- PCIe/NVMe
- USB gadget
- USB host
Signed-off-by: Jonas Karlman <[email protected]>
Tested-by: FUKAUMI Naoki <[email protected]>
Reviewed-by: Kever Yang <[email protected]>
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The Radxa ROCK 3B is a single-board computer based on the Pico-ITX form
factor (100mm x 75mm). Two versions of the ROCK 3B exists, a community
version based on the RK3568 SoC and an industrial version based on the
RK3568J SoC.
Add initial support for eMMC, SD-card, Ethernet, HDMI, PCIe and USB.
Signed-off-by: Jonas Karlman <[email protected]>
Link: https://lore.kernel.org/r/[email protected]
Signed-off-by: Heiko Stuebner <[email protected]>
[ upstream commit: 846ef7748fa9124c8eea76e2d5e833fa69b3ef7c ]
(cherry picked from commit 5416329b387d3c13392f84ba35273a402c7010f8)
Reviewed-by: Kever Yang <[email protected]>
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Based on rock-3a-rk3568_defconfig.
Tested on v1.31 revision.
Board Specifications:
- Rockchip RK3566
- 1/2/4GB LPDDR4 2112MT/s
- eMMC socket
- uSD card slot
- M.2 2230 Connector
- GbE LAN with POE
- 3.5mm jack with mic
- HDMI 2.0, MIPI DSI/CSI
- USB 3.0 Host, USB 2.0 Host/OTG
- 40-pin GPIO expansion ports
Signed-off-by: Maxim Moskalets <[email protected]>
Suggested-by: Jonas Karlman <[email protected]>
Reviewed-by: Jonas Karlman <[email protected]>
Tested-by: FUKAUMI Naoki <[email protected]>
Reviewed-by: Kever Yang <[email protected]>
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Radxa ROCK S0 is a single-board computer based on the Rockchip RK3308B
SoC in an ultra-compact form factor. Add a board target for the board.
Features tested on a ROCK S0 v1.2 with 512 MiB RAM and 8 GiB eMMC:
- SD-card boot
- eMMC boot
- Ethernet
- USB gadget
- USB host
Signed-off-by: Jonas Karlman <[email protected]>
Reviewed-by: Kever Yang <[email protected]>
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Radxa ROCK S0 is a single-board computer based on the Rockchip RK3308B
SoC in an ultra-compact form factor.
Add initial support for eMMC, SD-card, Ethernet, WiFi/BT and USB.
Signed-off-by: Jonas Karlman <[email protected]>
Link: https://lore.kernel.org/r/[email protected]
Signed-off-by: Heiko Stuebner <[email protected]>
[ upstream commit: adeb5d2a4ba47910238b3c4f5fd960cc0c26a98b ]
(cherry picked from commit e291d457b0378f2cb3d3ebb597032ca862cdb973)
Reviewed-by: Kever Yang <[email protected]>
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Add LED=y and LED_GPIO=y to support the onboard leds.
Add ROCKCHIP_IODOMAIN=y to configure correct io voltage domains.
Add DM_MDIO=y now that the DT contain a Ethernet phy node.
Signed-off-by: Jonas Karlman <[email protected]>
Reviewed-by: Kever Yang <[email protected]>
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With the emmc and uart0 DT nodes updated to v6.11-rc1 in dts/upstream
there is no longer any need to keep overrides in board u-boot dtsi.
Signed-off-by: Jonas Karlman <[email protected]>
Reviewed-by: Kever Yang <[email protected]>
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Update WiFi SDIO and BT UART related props to better reflect details
about the optional onboard RTL8723DS WiFi/BT module.
Also correct the compatible used for bluetooth to match the WiFi/BT
module used on the board.
Fixes: bc3753aed81f ("arm64: dts: rockchip: rock-pi-s add more peripherals")
Signed-off-by: Jonas Karlman <[email protected]>
Link: https://lore.kernel.org/r/[email protected]
Signed-off-by: Heiko Stuebner <[email protected]>
[ upstream commit: 12c3ec878cbe3709782e85b88124abecc3bb8617 ]
(cherry picked from commit caba73747c927b4fdccea3aeb16e077b4e6af006)
Reviewed-by: Kever Yang <[email protected]>
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The VCCIO4 io-domain used for WiFi/BT is using 1v8 IO signal voltage.
Add io-domains node with the VCCIO supplies connected on the board.
Signed-off-by: Jonas Karlman <[email protected]>
Link: https://lore.kernel.org/r/[email protected]
Signed-off-by: Heiko Stuebner <[email protected]>
[ upstream commit: 100b3bdee6035192f6d4a1847970fe004bb505fb ]
(cherry picked from commit f93b224359278728f01767a4701678ada9c25570)
Reviewed-by: Kever Yang <[email protected]>
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Be explicit about the Ethernet port and define mdio and ethernet-phy
nodes in the device tree for ROCK Pi S.
Fixes: bc3753aed81f ("arm64: dts: rockchip: rock-pi-s add more peripherals")
Signed-off-by: Jonas Karlman <[email protected]>
Link: https://lore.kernel.org/r/[email protected]
Signed-off-by: Heiko Stuebner <[email protected]>
[ upstream commit: 4b64ed510ed946a4e4ca6d51d6512bf5361f6a04 ]
(cherry picked from commit 703b8eae20eec5dbb0e52f0e1fb71e712c007dae)
Reviewed-by: Kever Yang <[email protected]>
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UAR0 CTS/RTS is not wired to any pin and is not used for the default
serial console use of UART0 on ROCK Pi S.
Override the SoC defined pinctrl props to limit configuration of the
two xfer pins wired to one of the GPIO pin headers.
Fixes: 2e04c25b1320 ("arm64: dts: rockchip: add ROCK Pi S DTS support")
Signed-off-by: Jonas Karlman <[email protected]>
Link: https://lore.kernel.org/r/[email protected]
Signed-off-by: Heiko Stuebner <[email protected]>
[ upstream commit: 7affb86ef62581e3475ce3e0a7640da1f2ee29f8 ]
(cherry picked from commit 9c72cd5fa9f971be8ebbc1f43bd74a72e33db2fa)
Reviewed-by: Kever Yang <[email protected]>
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Add cap-mmc-highspeed to allow use of high speed MMC mode using an eMMC
to uSD board. Use disable-wp to signal that no physical write-protect
line is present. Also add vcc_io used for card and IO line power as
vmmc-supply.
Fixes: 2e04c25b1320 ("arm64: dts: rockchip: add ROCK Pi S DTS support")
Signed-off-by: Jonas Karlman <[email protected]>
Link: https://lore.kernel.org/r/[email protected]
Signed-off-by: Heiko Stuebner <[email protected]>
[ upstream commit: fc0daeccc384233eadfa9d5ddbd00159653c6bdc ]
(cherry picked from commit 39110e4bec51c9ce6bbd342234b288dbfccb9f80)
Reviewed-by: Kever Yang <[email protected]>
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Add a disabled RK3308 IO voltage domains node to SoC DT.
Signed-off-by: Jonas Karlman <[email protected]>
Link: https://lore.kernel.org/r/[email protected]
Signed-off-by: Heiko Stuebner <[email protected]>
[ upstream commit: d1829ba469d5743734e37d59fece73e3668ab084 ]
(cherry picked from commit cebde305971e33a76efc3280e09814499ef89f54)
Reviewed-by: Kever Yang <[email protected]>
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The RK3308 SoC contains a controller for one-time-programmable memory,
add a device node for it.
Signed-off-by: Jonas Karlman <[email protected]>
Link: https://lore.kernel.org/r/[email protected]
Signed-off-by: Heiko Stuebner <[email protected]>
[ upstream commit: 36d3bbc8cdbef2f83391f7708888265ac4c37a99 ]
(cherry picked from commit db11d284200d0f811a8f8238dbc9c63daf4e6131)
Reviewed-by: Kever Yang <[email protected]>
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The merged upstream DT node for OTP differs in nodename and will cause
following build errors once rk3308.dtsi in dts/upstream is updated:
ERROR (duplicate_label): /nvmem@ff210000: Duplicate label 'otp' on /nvmem@ff210000 and /efuse@ff210000
ERROR (duplicate_label): /nvmem@ff210000/id@7: Duplicate label 'cpu_id' on /nvmem@ff210000/id@7 and /efuse@ff210000/id@7
Remove the OTP device node from soc u-boot dtsi in preparation for
replacing it with the merged upstream DT node in dts/upstream.
Signed-off-by: Jonas Karlman <[email protected]>
Reviewed-by: Kever Yang <[email protected]>
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RK3399 Puma has support for driving multiple displays at the same time,
the most notable scenario being HDMI+DSI since there exists a devkit
with both DSI display and HDMI output.
While HDMI seems to work fine in U-Boot, as the U-Boot logo is shown
whenever the EFI bootmeth is used, it messes up DSI in HDMI+DSI setup in
the Linux kernel. There are some ways to work around this bug but no
known appropriate fix for now, so let's rather not trigger this bug.
Since there isn't any client of ours that seems to be using this
feature, let's disable it for now. Users can re-enable this feature in
the event they have HDMI-only products.
Signed-off-by: Quentin Schulz <[email protected]>
Reviewed-by: Kever Yang <[email protected]>
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The name of rk3568 evb in mainline kernel is rk3568-evb1-v10.
Signed-off-by: Kever Yang <[email protected]>
Reviewed-by: Quentin Schulz <[email protected]>
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Most Rockchip aarch64 targets have now migrated to use OF_UPSTREAM,
however a few of the old dtsi and dt-bindings files still remain.
Remove remaining common dtsi and header files that can be included
directly from dts/upstream to prevent possible issues when future tags
from devicetree-binding is merged. No changes is expected with this.
Signed-off-by: Jonas Karlman <[email protected]>
Reviewed-by: Quentin Schulz <[email protected]>
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The commit f087f7fd277d ("rockchip: px30/rk3326: migrate to
OF_UPSTREAM") migrated px30/rk3326 boards to use OF_UPSTREAM, however
the soc dtsi and dt-bindings files remained.
Remove the remaining px30/rk3326 soc dtsi and dt-bindings to ensure the
files from dts/upstream is used.
The gpio-ranges props is moved to u-boot.dtsi files and a ethernet0
alias is added to px30-firefly, they are missing in the dts/upstream
files. No changes are expected with this.
Signed-off-by: Jonas Karlman <[email protected]>
Reviewed-by: Quentin Schulz <[email protected]>
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The device tree for Rockchip Toybrick TB-RK3588X has been merged into
dts/upstream with devicetree-rebasing v6.10-dts, migrate board to
OF_UPSTREAM.
Signed-off-by: Jonas Karlman <[email protected]>
Reviewed-by: Kever Yang <[email protected]>
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The device tree for Pine64 PineTab2 has been merged into dts/upstream
with devicetree-rebasing v6.10-dts, migrate board to OF_UPSTREAM.
Signed-off-by: Jonas Karlman <[email protected]>
Reviewed-by: Kever Yang <[email protected]>
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Port the RK3308 part of the Rockchip IO Domain driver from linux.
This differs from linux version in that vccio3 iodomain bit is enabled
in the write ops instead of in an init ops as in linux, this way we can
avoid keeping a full state of all supply that have been configured.
Signed-off-by: Jonas Karlman <[email protected]>
Reviewed-by: Kever Yang <[email protected]>
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Hosts capable of 8-bit can also do 4 bits, fix use of 4-bit mode when
8-bit mode is supported.
This fixes use of 1-bit mode with SD NAND on ROCK Pi S using the DT in
v6.11-rc1 that chage to use 8-bit bus to also support eMMC. With this
4-bit mode is used with SD NAND and 8-bit mode with eMMC, same as in
Linux kernel.
Signed-off-by: Jonas Karlman <[email protected]>
Reviewed-by: Kever Yang <[email protected]>
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Fix multiplex configuration for PCIe1L0 and PCIe1L1 in PCIESEL_CON for
RK3588 to correctly select between Combo PHYs and PCIe3 PHY.
Currently, the code incorrectly muxes both ports to Combo PHYs,
interfering with PCIe3 PHY settings.
Introduce PHY identifiers to identify the correct Combo PHY and set
the necessary bits accordingly.
This fix is adapted from the upstream Linux commit by Sebastian Reichel:
d16d4002fea6 ("phy: rockchip: naneng-combphy: Fix mux on rk3588")
Fixes: b37260bca1aa ("phy: rockchip: naneng-combphy: Use signal from comb PHY on RK3588")
Reviewed-by: Kever Yang <[email protected]>
Signed-off-by: Sebastian Kropatsch <[email protected]>
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Conversion to DM_I2C is mandatory, enable DM_I2C
to disable board removal warning.
Signed-off-by: Anatolij Gustschin <[email protected]>
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Conversion to DM_I2C is mandatory, enable DM_I2C to fix board
removal warning. Convert EEPROM access to use DM_I2C API.
Signed-off-by: Anatolij Gustschin <[email protected]>
Reviewed-by: Fabio Estevam <[email protected]>
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Conversion to DM_I2C is mandatory, enable DM_I2C
to disable board removal warning.
Signed-off-by: Anatolij Gustschin <[email protected]>
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Conversion to DM_I2C is mandatory, enable DM_I2C
to disable board removal warning. Convert EEPROM
and IT6251 access to use DM_I2C API.
Signed-off-by: Anatolij Gustschin <[email protected]>
Reviewed-by: Marek Vasut <[email protected]>
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Conversion to DM_I2C is mandatory, enable DM_I2C
to disable board removal warning.
Signed-off-by: Anatolij Gustschin <[email protected]>
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Conversion to DM_I2C is mandatory, enable DM_I2C
to disable board removal warning.
Signed-off-by: Anatolij Gustschin <[email protected]>
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Conversion to DM_I2C is mandatory, enable DM_I2C
to disable board removal warning.
Signed-off-by: Anatolij Gustschin <[email protected]>
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Conversion to DM_I2C is mandatory, enable DM_I2C
to disable board removal warning.
Signed-off-by: Anatolij Gustschin <[email protected]>
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Conversion to DM_I2C is mandatory, enable DM_I2C
to disable board removal warning.
Signed-off-by: Anatolij Gustschin <[email protected]>
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Conversion to DM_I2C is mandatory, rework to remove
use of legacy I2C API.
Signed-off-by: Anatolij Gustschin <[email protected]>
Reviewed-by: Heiko Schocher <[email protected]>
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Dhruva Gole <[email protected]> says:
This series aims to add documentation around the boot flow and tispl
packaging details regarding the TIFS Stub. While at it, also refactors the
k3 common docs to add more labels to provide more granularity on how we
include chunks from common docs into SoC specific docs.
This series also includes the binman related changes required to package
TIFS Stub to support Low Power Modes on BeaglePlay and phycore-am625 SOM.
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Add support for packaging the TIFS Stub as it's required for basic Low
Power Modes like Deep Sleep.
The reason it is packaged using binman and not inherently as part of the
DM firmware is because for HS devices, customer owns the customer key
and only customer has access to it.
DM is release by TI, Since TI doesn't have access to the customer key it
cannot have a component that is signed by customer key.
Hence, it's left as part of binman to be signed and packaged.
While at it, also make sure it's documented in phycore-am62x
Reviewed-by: Nishanth Menon <[email protected]>
Reviewed-by: Wadim Egorov <[email protected]>
Signed-off-by: Dhruva Gole <[email protected]>
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* Include the actual common documentation about the TIFS Stub and role
it plays to enable Low Power Modes in the platform.
* Add the AM62x boot flow to show at which point the TIFS Stub actually
gets loaded.
* Mention the TIFS Stub in the TISPL image format.
Reviewed-by: Nishanth Menon <[email protected]>
Signed-off-by: Dhruva Gole <[email protected]>
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Add support for packaging the TIFS Stub as it's required for basic Low
Power Modes like Deep Sleep.
The reason it is packaged using binman and not inherently as part of the
DM firmware is because for HS devices, customer owns the customer key
and only customer has access to it.
DM is release by TI, Since TI doesn't have access to the customer key it
cannot have a component that is signed by customer key.
Hence, it's left as part of binman to be signed and packaged.
Reviewed-by: Nishanth Menon <[email protected]>
Acked-by: Neha Malcom Francis <[email protected]>
Signed-off-by: Dhruva Gole <[email protected]>
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Since AM62x, AM62P and AM62A all use similar boot flows and their low
power mode s/w ARCH is also similar in the way that they make use of the
TIFS Stub, update their documentation to show where TIFS Stub is.
Reviewed-by: Nishanth Menon <[email protected]>
Signed-off-by: Dhruva Gole <[email protected]>
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Use the new boot_firmwares labels that help make documentation more
specific as to which firmwares are used in which devices
Signed-off-by: Dhruva Gole <[email protected]>
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* Add documentation to briefly explain the role of TIFS Stub in relevant
K3 SoC's.
* Shed light on why TIFS Stub isn't package with the DM firmware itself.
* Modify the platform docs wherever the TIFS Stub documentation applies.
* Also, refactor and add a few new labels to help split the firmware
documentation chunks. This will make it easier to include them one by
one wherever applicable
Reviewed-by: Nishanth Menon <[email protected]>
Signed-off-by: Dhruva Gole <[email protected]>
Acked-by: Francesco Dolcini <[email protected]> # verdin-am62
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Add entry for the TI boards documentation under ARM TI
Reviewed-by: Nishanth Menon <[email protected]>
Signed-off-by: Dhruva Gole <[email protected]>
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https://source.denx.de/u-boot/custodians/u-boot-nand-flash
This series adds support for the UBI block device, which allows to read/write
data block by block. The series was tested by Alexey Romanov on SPI NAND.
The patches pass the pipeline CI:
https://source.denx.de/u-boot/custodians/u-boot-nand-flash/-/pipelines/21933
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UBI block is virtual block device, which is an abstraction
over MTD layer. Therefore it is logical to use it in combination
with MTD drivers.
Signed-off-by: Alexey Romanov <[email protected]>
Reviewed-by: Frieder Schrempf <[email protected]>
Signed-off-by: Michael Trimarchi <[email protected]>
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UBI partition is abstraction over UBI volumes.
Can be used by UBI block device.
Signed-off-by: Alexey Romanov <[email protected]>
Reviewed-by: Heiko Schocher <[email protected]>
Signed-off-by: Michael Trimarchi <[email protected]>
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