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| author | Tom Rini <[email protected]> | 2026-04-27 08:05:40 -0600 |
|---|---|---|
| committer | Tom Rini <[email protected]> | 2026-04-27 08:05:40 -0600 |
| commit | e0991f42aa7f973e09f38bbe60cd12b28a46e491 (patch) | |
| tree | 66619177875432ae895a1e068532bfaa036b686e /cpu/nios/Makefile | |
| parent | 1a4cb8dc03810f2fb0b1499e26bae32e5116df4c (diff) | |
| parent | fabf5878bb86b3e1e2b19301afc2a9180bf79cf6 (diff) | |
Merge branch 'casey/qcom-main-13Apr2026' of https://source.denx.de/u-boot/custodians/u-boot-snapdragonHEADmaster
Various Qualcomm additions this cycle:
* USB superspeed support for 1 platform
* Initial support for the Milos platform and the Fairphone Gen 6
(chainloaded from ABL)
* Improved support for booting with OP-TEE on supported platforms
* Initial basic power domain support
Notably there is a generic change to the device core, missing power
domains will no longer cause a device to fail probe and instead will
just print a warning. This shouldn't affect any existing platforms.
Diffstat (limited to 'cpu/nios/Makefile')
0 files changed, 0 insertions, 0 deletions