diff options
| author | Casey Connolly <[email protected]> | 2026-01-14 14:57:32 +0100 |
|---|---|---|
| committer | Casey Connolly <[email protected]> | 2026-01-14 16:25:09 +0100 |
| commit | 9be4f2f5f4d0b8327befde42c743336fa63fc43b (patch) | |
| tree | 64d6dba36065a03ec75296ccd1d11c3b2e4d88ae /doc/develop/bootstd | |
| parent | 338c4b820804323c9c02521df5796c82b6dc1e81 (diff) | |
mach-snapdragon: of_fixup: support new flat dwc3 node
Qualcomm DTs are being updated to use a new format where the dwc3 glue
node and controller are combined into a single DT node. Update the fixup
code to handle this case.
Reviewed-by: Neil Armstrong <[email protected]>
Link: https://patch.msgid.link/[email protected]
Signed-off-by: Casey Connolly <[email protected]>
Diffstat (limited to 'doc/develop/bootstd')
0 files changed, 0 insertions, 0 deletions