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2023-07-24riscv: dts: jh7110: Add clock source from PLLXingyu Wu
Change the PLL clock source from syscrg to sys_syscon child node. Signed-off-by: Xingyu Wu <[email protected]> Signed-off-by: Hal Feng <[email protected]> Reviewed-by: Torsten Duwe <[email protected]> Reviewed-by: Leo Yu-Chi Liang <[email protected]>
2023-07-24riscv: dts: jh7110: Add PLL clock controller nodeXingyu Wu
Add child node about PLL clock controller in sys_syscon node. Signed-off-by: Xingyu Wu <[email protected]> Signed-off-by: Hal Feng <[email protected]> Reviewed-by: Torsten Duwe <[email protected]> Reviewed-by: Leo Yu-Chi Liang <[email protected]>
2023-07-24clk: starfive: jh7110: Separate the PLL driverXingyu Wu
Drop the PLL part in SYSCRG driver and separate to be a single PLL driver of which the compatible is "starfive,jh7110-pll". Signed-off-by: Xingyu Wu <[email protected]> Signed-off-by: Hal Feng <[email protected]> Reviewed-by: Torsten Duwe <[email protected]> Reviewed-by: Leo Yu-Chi Liang <[email protected]>
2023-07-24riscv: setup per-hart stack earlierBo Gan
Harts need to use per-hart stack before any function call, even if that function is a simple one. When the callee uses stack for register save/ restore, especially RA, if nested call, concurrent access by multiple harts on the same stack will cause data-race. This patch sets up SP before `board_init_f_alloc_reserve`. A side effect of this is that the memory layout has changed as the following: +----------------+ +----------------+ <----- SPL_STACK/ | ...... | | hart 0 stack | SYS_INIT_SP_ADDR | malloc_base | +----------------+ +----------------+ | hart 1 stack | | GD | +----------------+ If not SMP, N=1 +----------------+ | ...... | | hart 0 stack | +----------------+ +----------------+ ==> | hart N-1 stack| | hart 1 stack | +----------------+ +----------------+ | ...... | | ...... | | malloc_base | +----------------+ +----------------+ | hart N-1 stack| | GD | +----------------+ +----------------+ | | | | Signed-off-by: Bo Gan <[email protected]> Cc: Rick Chen <[email protected]> Cc: Leo <[email protected]> Cc: Sean Anderson <[email protected]> Cc: Bin Meng <[email protected]> Cc: Lukas Auer <[email protected]> Reviewed-by: Rick Chen <[email protected]> Reviewed-by: Leo Yu-Chi Liang <[email protected]>
2023-07-23Merge branch '2023-07-22-TI-binman-and-K3-improvements'Tom Rini
- Migrate TI K3 platforms to using binman to generate all images, and then improve the platform slightly.
2023-07-21configs: am64: Fix booting of fitImage on AM64xKamlesh Gurudasani
Do not limit the maximum size of the buffer that is used to decompress the OS image in to, this causes issue while inflating the image, if image size is greater than the buffer. Remove CONFIG_SYS_BOOTM_LEN Signed-off-by: Kamlesh Gurudasani <[email protected]> Signed-off-by: Manorit Chawdhry <[email protected]>
2023-07-21Kconfig: Enable FIT_SIGNATURE if ARM64Manorit Chawdhry
Enabling FIT_SIGNATURE required the old authentication method to be disabled so disable this for K3 SOCs and enable FIT_SIGNATURE for K3 Platforms. Signed-off-by: Kamlesh Gurudasani <[email protected]> [ cleanup the patch ] Signed-off-by: Manorit Chawdhry <[email protected]>
2023-07-21lib: Kconfig: k3: Enable SHA512 for fit signatureManorit Chawdhry
We are using our custMpk for signing that is a 4096 bit key, 4096 bit rsa key requires a SHA512 hashing algorithm to be enabled as per the source. Even though it is not mandated but this is how it works and is tested. Enables SHA512 if fit signature is enabled on K3 platforms. Signed-off-by: Manorit Chawdhry <[email protected]>
2023-07-21k3-*-binman: dts: Pack u-boot.dtb instead of soc specific dtbManorit Chawdhry
FIT signature requires the updates to u-boot.dtb and the DTB that we pack don't get updates with the changes of the signature node. Pack u-boot.dtb as the default DTB so that the signature node changes can be reflected in them. (Note, this is only packaging the primary platform and the secondary platform will require manual changes for the FIT signature enablement) Signed-off-by: Manorit Chawdhry <[email protected]> [ add additional boards that were missing ] Signed-off-by: Kamlesh Gurudasani <[email protected]> Reviewed-by: Simon Glass <[email protected]>
2023-07-21board: ti: keys: add .key and .crt for fit signature signingManorit Chawdhry
Fit signature mechanism through the standards require the presence of .key and .crt in the folder with the same name, since we are using our custMpk only for the signing, update the format to that of standards to be compatible for packaging easily. Signed-off-by: Manorit Chawdhry <[email protected]>
2023-07-21configs: k3: make consistent bootcmd across all k3 socsKamlesh Gurudasani
Default to common bootcmd that is set across all k3 devices. Signed-off-by: Manorit Chawdhry <[email protected]> Signed-off-by: Kamlesh Gurudasani <[email protected]>
2023-07-21include: armv7: Enable distroboot across all configsManorit Chawdhry
Since K3 devices are moving towards distroboot, remove duplicates and add it in common file to import from. Signed-off-by: Manorit Chawdhry <[email protected]> [trini: Add am65x_evm to this patch] Signed-off-by: Tom Rini <[email protected]>
2023-07-21env: Make common bootcmd across all k3 devicesManorit Chawdhry
This is helpful to go forward with distro_bootcmd as default boot. Signed-off-by: Manorit Chawdhry <[email protected]>
2023-07-21arm: k3: Add regex/gsub command handlingAndrew Davis
The 'gsub' setexpr sub command is using when creating the FIT image configuration string on K3 devices. Enable this for K3. Signed-off-by: Andrew Davis <[email protected]> Signed-off-by: Manorit Chawdhry <[email protected]>
2023-07-21configs: Enable setexpr command on TI devicesAndrew Davis
This is used when building the FIT image configuration string. Enable it for all FIT using TI platforms. Signed-off-by: Andrew Davis <[email protected]> [ extend to other k3 boards ] Signed-off-by: Manorit Chawdhry <[email protected]>
2023-07-21environment: ti: Make get_fdt_mmc commonAndrew Davis
Since get_fdt_mmc is common, factor it out into mmc.env and remove it from each platform env file along with changing the directory path to reflect the standards. Use it in mmcloados but keep loadfdt defined in case it is still used by some external uEnv.txt script. Signed-off-by: Andrew Davis <[email protected]> Signed-off-by: Manorit Chawdhry <[email protected]>
2023-07-21environment: ti: Prefix ARM64 DTB names with directoryAndrew Davis
In Linux the ARM64 DTSs are stored in vendor directories to help organize the files and prevent naming collisions. The deployed DTBs will mirror this and so the vendor prefix should be added to the variable used to locate these files. Suggested-by: Ryan Eatmon <[email protected]> Signed-off-by: Andrew Davis <[email protected]> Signed-off-by: Manorit Chawdhry <[email protected]> Reviewed-by: Nikhil M Jain <[email protected]>
2023-07-21configs: k3: Remove saved environmentsManorit Chawdhry
Having saved environments usually causes inconsistencies while in development workflow. The saved environments conflict with the default ones that U-boot should be updating during development but that doesn't happen and the saved environments need to be reset during bootups to test the changes causing extra debugs. Remove the saved environments as a default. Environments can always be re-enabled locally if one does like them or needs them for some production environment. Optionally, Uenv.txt can also be used on some of the boot media. Signed-off-by: Manorit Chawdhry <[email protected]>
2023-07-21include: j7*_evm.h: Cleanups to be doneManorit Chawdhry
Some miscellaneous cleanups for boards. Signed-off-by: Manorit Chawdhry <[email protected]>
2023-07-21mach-k3: common: correct the calculations for determining firewallsManorit Chawdhry
The background firewall calculations were wrong, fix that to determine both the background and foreground correctly. Fixes: 8bfce2f9989f ("arm: mach-k3: common: reorder removal of firewalls") Signed-off-by: Manorit Chawdhry <[email protected]>
2023-07-21board: ti: am64x: am64x.env: set fdtfile env variableKamlesh Gurudasani
Set fdtfile env variable similar to other k3 socs. Signed-off-by: Kamlesh Gurudasani <[email protected]> Signed-off-by: Manorit Chawdhry <[email protected]> Reviewed-by: Nikhil M Jain <[email protected]>
2023-07-21Kconfig: j721s2: Fix the scratchpad baseManorit Chawdhry
Fix the regression that occurred during the alignment of binman series merges along with these HS fixes that caused silent regression in this. Fixes: 30a7ee87fd1a ("Kconfig: j721s2: Change K3_MCU_SCRATCHPAD_BASE to non firewalled region") Signed-off-by: Manorit Chawdhry <[email protected]>
2023-07-21arch: mach-k3: security: fix the check for authenticationManorit Chawdhry
Fix regression occurred during refactoring for the mentioned commit. Fixes: bd6a24759374 ("arm: mach-k3: security: separate out validating binary logic") Signed-off-by: Manorit Chawdhry <[email protected]>
2023-07-21CI: Make use of buildman requirements.txtTom Rini
Now that buildman has a requirements.txt file we need to make use of it. Reviewed-by: Simon Glass <[email protected]> [[email protected]: Adding missing command from .azure-pipelines.yml] Signed-off-by: Neha Malcom Francis <[email protected]> Signed-off-by: Tom Rini <[email protected]>
2023-07-21buildman: Create a requirements.txt fileTom Rini
At this point, buildman requires a few different modules and so we need a requirements.txt to track what modules are needed. Cc: Simon Glass <[email protected]> Cc: Neha Malcom Francis <[email protected]> Reviewed-by: Simon Glass <[email protected]> Signed-off-by: Neha Malcom Francis <[email protected]> Signed-off-by: Tom Rini <[email protected]>
2023-07-21binman: Overwrite symlink if it already existsAndrew Davis
Without this re-building will fail with an error when trying to create the symlink for the second time with an already exists error. Signed-off-by: Andrew Davis <[email protected]> [[email protected]: Added support for test output dir and testcase] Signed-off-by: Neha Malcom Francis <[email protected]>
2023-07-21doc: board: ti: Update documentation for binman flowNeha Malcom Francis
Earlier documentation specified builds for generating bootloader images using an external TI repository k3-image-gen and core-secdev-k3. Modify this to using the binman flow so that user understands how to build the final boot images. Reviewed-by: Simon Glass <[email protected]> Signed-off-by: Neha Malcom Francis <[email protected]>
2023-07-21k3: tools: config.mk: Update makefile and remove scriptsNeha Malcom Francis
Since binman is used to package bootloader images for all K3 devices, we do not have to rely on the earlier methods to package them. Scripts that were used to generate x509 certificate for tiboot3.bin and generate tispl.bin, u-boot.img have been removed. Reviewed-by: Simon Glass <[email protected]> Signed-off-by: Neha Malcom Francis <[email protected]>
2023-07-21arm: k3-am65x-iot2050: Use binman for tispl.bin for iot2050Neha Malcom Francis
Move to using binman to generate tispl.bin which is used to generate the final flash.bin bootloader for iot2050 boards. Cc: Jan Kiszka <[email protected]> Reviewed-by: Simon Glass <[email protected]> Signed-off-by: Neha Malcom Francis <[email protected]>
2023-07-21am62a: dts: binman: Package tiboot3.bin, tispl.bin, u-boot.imgNeha Malcom Francis
Support added for HS-SE, HS-FS and GP boot binaries for AM62ax. HS-SE: * tiboot3-am62ax-hs-evm.bin * tispl.bin * u-boot.img HS-FS: * tiboot3-am62ax-hs-fs-evm.bin * tispl.bin * u-boot.img GP: * tiboot3.bin --> tiboot3-am62ax-gp-evm.bin * tispl.bin_unsigned * u-boot.img_unsigned It is to be noted that the bootflow followed by AM62ax requires: tiboot3.bin: * R5 SPL * R5 SPL dtbs * TIFS * board-cfg * pm-cfg * sec-cfg * rm-cfg tispl.bin: * DM * ATF * OP-TEE * A72 SPL * A72 SPL dtbs u-boot.img: * A72 U-Boot * A72 U-Boot dtbs Reviewed-by: Simon Glass <[email protected]> [[email protected]: changed output binary names appropriately] Signed-off-by: Andrew Davis <[email protected]> Signed-off-by: Neha Malcom Francis <[email protected]>
2023-07-21am62a: yaml: Add board configs for AM62axNeha Malcom Francis
Added YAML configs for AM62ax Signed-off-by: Neha Malcom Francis <[email protected]>
2023-07-21am625: dts: binman: Package tiboot3.bin, tispl.bin and u-boot.imgNeha Malcom Francis
Support added for HS-SE, HS-FS and GP boot binaries for AM62. HS-SE: * tiboot3-am62x-hs-evm.bin * tispl.bin * u-boot.img HS-FS: * tiboot3-am62x-hs-fs-evm.bin * tispl.bin * u-boot.img GP: * tiboot3.bin --> tiboot3-am62x-gp-evm.bin * tispl.bin_unsigned * u-boot.img_unsigned It is to be noted that the bootflow followed by AM62 requires: tiboot3.bin: * R5 SPL * R5 SPL dtbs * TIFS * board-cfg * pm-cfg * sec-cfg * rm-cfg tispl.bin: * DM * ATF * OP-TEE * A72 SPL * A72 SPL dtbs u-boot.img: * A72 U-Boot * A72 U-Boot dtbs Reviewed-by: Simon Glass <[email protected]> [[email protected]: changed output binary names appropriately] Signed-off-by: Andrew Davis <[email protected]> Signed-off-by: Neha Malcom Francis <[email protected]>
2023-07-21am62: yaml: Add board configs for AM62Neha Malcom Francis
Added YAML configs for AM62 Signed-off-by: Neha Malcom Francis <[email protected]>
2023-07-21j721s2: dts: binman: Package tiboot3.bin, tispl.bin and u-boot.imgNeha Malcom Francis
Support has been added for both HS-SE, HS-FS and GP images. HS-SE: * tiboot3-j721s2-hs-evm.bin * tispl.bin * u-boot.img HS-FS: * tiboot3-j721s2-hs-fs-evm.bin * tispl.bin * u-boot.img GP: * tiboot3.bin --> tiboot3-j721s2-gp-evm.bin * tispl.bin_unsigned * u-boot.img_unsigned It is to be noted that the bootflow followed by J721S2 requires: tiboot3.bin: * R5 SPL * R5 SPL dtbs * TIFS * board-cfg * pm-cfg * sec-cfg * rm-cfg tispl.bin: * DM * ATF * OP-TEE * A72 SPL * A72 SPL dtbs u-boot.img: * A72 U-Boot * A72 U-Boot dtbs Reviewed-by: Simon Glass <[email protected]> [[email protected]: changed output binary names appropriately] Signed-off-by: Andrew Davis <[email protected]> Signed-off-by: Neha Malcom Francis <[email protected]>
2023-07-21j721s2: yaml: Add board configs for J721S2Neha Malcom Francis
Added YAML configs for J721S2 Signed-off-by: Neha Malcom Francis <[email protected]>
2023-07-21am64x: dts: binman: Package tiboot3.bin, tispl.bin u-boot.imgNeha Malcom Francis
Support added for HS and GP boot binaries for AM64x. HS-SE: * tiboot3-am64x_sr2-hs-evm.bin * tispl.bin * u-boot.img HS-FS: * tiboot3-am64x_sr2-hs-fs-evm.bin * tispl.bin * u-boot.img GP: * tiboot3.bin --> tiboot3-am64x-gp-evm.bin * tispl.bin_unsigned * u-boot.img_unsigned Note that the bootflow followed by AM64x requires: tiboot3.bin: * R5 SPL * R5 SPL dtbs * sysfw * board-cfg * pm-cfg * sec-cfg * rm-cfg tispl.bin: * ATF * OP-TEE * A53 SPL * A53 SPL dtbs u-boot.img: * A53 U-Boot * A53 U-Boot dtbs Reviewed-by: Simon Glass <[email protected]> [[email protected]: changed output binary names appropriately] Signed-off-by: Andrew Davis <[email protected]> Signed-off-by: Neha Malcom Francis <[email protected]>
2023-07-21am64x: yaml: Add board configs for AM64xNeha Malcom Francis
Added YAML configs for AM64xx Signed-off-by: Neha Malcom Francis <[email protected]>
2023-07-21am65: dts: binman: Package tiboot3.bin, sysfw.itb, tispl.bin, u-boot.imgNeha Malcom Francis
Support has been added for both HS-SE(SR 2.0) and GP(SR 2.0) images. HS-SE: * tiboot3-am65x_sr2-hs-evm.bin * sysfw-am65x_sr2-hs-evm.itb * tispl.bin * u-boot.img GP: * tiboot3.bin --> tiboot3-am65x_sr2-gp-evm.bin * sysfw.itb --> sysfw-am65x_sr2-gp-evm.itb * tispl.bin_unsigned * u-boot.img_unsigned Note that the bootflow followed by AM65x requires: tiboot3.bin: * R5 SPL * R5 SPL dtbs sysfw.itb: * sysfw * board-cfg * pm-cfg * sec-cfg * rm-cfg tispl.bin: * ATF * OP-TEE * A53 SPL * A53 SPL dtbs u-boot.img: * A53 U-Boot * A53 U-Boot dtbs Reviewed-by: Simon Glass <[email protected]> [[email protected]: changed output binary names appropriately] Signed-off-by: Andrew Davis <[email protected]> Signed-off-by: Neha Malcom Francis <[email protected]>
2023-07-21am65x: yaml: Add AM65x board config filesNeha Malcom Francis
Added YAML configs for AM65x Signed-off-by: Neha Malcom Francis <[email protected]>
2023-07-21j7200: dts: binman: Package tiboot3.bin, tispl.bin, u-boot.imgNeha Malcom Francis
Support has been added for both HS-SE(SR 2.0), HS-FS(SR 2.0) and GP images. HS-SE: * tiboot3-j7200_sr2-hs-evm.bin * tispl.bin * u-boot.img HS-FS: * tiboot3-j7200_sr2-hs-fs-evm.bin * tispl.bin * u-boot.img GP: * tiboot3.bin --> tiboot3-j7200-gp-evm.bin * tispl.bin_unsigned * u-boot.img_unsigned It is to be noted that the bootflow followed by J7200 requires: tiboot3.bin: * R5 SPL * R5 SPL dtbs * TIFS * board-cfg * pm-cfg * sec-cfg * rm-cfg tispl.bin: * DM * ATF * OP-TEE * A72 SPL * A72 SPL dtbs u-boot.img: * A72 U-Boot * A72 U-Boot dtbs Reviewed-by: Simon Glass <[email protected]> [[email protected]: changed output binary names appropriately] Signed-off-by: Andrew Davis <[email protected]> Signed-off-by: Neha Malcom Francis <[email protected]>
2023-07-21j7200: yaml: Add J7200 board config filesNeha Malcom Francis
Added YAML configs for J7200 Signed-off-by: Neha Malcom Francis <[email protected]>
2023-07-21j721e: dts: binman: Package tiboot3.bin, sysfw.itb, tispl.bin, u-boot.imgNeha Malcom Francis
By providing entries in the binman node of the device tree, binman will be able to find and package board config artifacts generated by TIBoardConfig with sysfw.bin and generate the final image sysfw.itb. It will also pick out the R5 SPL and sign it with the help of TI signing entry and generate the final tiboot3.bin. Entries for A72 build have been added to k3-j721e-binman.dtsi to generate tispl.bin and u-boot.img. Support has been added for both HS-SE(SR 1.1), HS-FS(SR 2.0) and GP images In HS-SE, the encrypted system firmware binary must be signed along with the signed certificate binary. HS-SE: * tiboot3-j721e_sr1_1-hs-evm.bin * sysfw-j721e_sr1_1-hs-evm.itb * tispl.bin * u-boot.img HS-FS: * tiboot3-j721e_sr2-hs-fs-evm.bin * sysfw-j721e_sr2-hs-fs-evm.itb * tispl.bin * u-boot.img GP: * tiboot3.bin -->tiboot3-j721e-gp-evm.bin * sysfw.itb --> sysfw-j721e-gp-evm.itb * tispl.bin_unsigned * u-boot.img_unsigned It is to be noted that the bootflow followed by J721E requires: tiboot3.bin: * R5 SPL * R5 SPL dtbs sysfw.itb: * TIFS * board-cfg * pm-cfg * sec-cfg * rm-cfg tispl.bin: * DM * ATF * OP-TEE * A72 SPL * A72 SPL dtbs u-boot.img: * A72 U-Boot * A72 U-Boot dtbs Reviewed-by: Simon Glass <[email protected]> [[email protected]: changed output binary names appropriately] Signed-off-by: Andrew Davis <[email protected]> Signed-off-by: Neha Malcom Francis <[email protected]>
2023-07-21j721e: schema: yaml: Add general schema and J721E board config filesNeha Malcom Francis
Schema file in YAML must be provided in board/ti/common for validating input config files and packaging system firmware. The schema includes entries for rm-cfg, board-cfg, pm-cfg and sec-cfg. Board config files must be provided in board/ti/<devicename> in YAML. These can then be consumed for generation of binaries to package system firmware. Added YAML configs for J721E in particular. Signed-off-by: Tarun Sahu <[email protected]> [[email protected]: prepared patch for upstreaming] Signed-off-by: Neha Malcom Francis <[email protected]>
2023-07-21arm: dts: k3: Add support for packaging sysfw.itb and tiboot3.binNeha Malcom Francis
Board config binary artifacts must be generated to be used by binman to package sysfw.itb and tiboot3.bin for all K3 devices. For devices that follow combined flow, these board configuration binaries must again be packaged into a combined board configuration blobs to be used by binman to package tiboot3.bin. Add common k3-binman.dtsi to generate all the board configuration binaries needed. Also add custMpk.pem and ti-degenerate-key.pem needed for signing GP and HS bootloader images common to all K3 devices. Reviewed-by: Simon Glass <[email protected]> Signed-off-by: Neha Malcom Francis <[email protected]>
2023-07-21binman: ti-secure: Add support for TI signingNeha Malcom Francis
The ti-secure entry contains certificate for binaries that will be loaded or booted by system firmware whereas the ti-secure-rom entry contains certificate for binaries that will be booted by ROM. Support for both these types of certificates is necessary for booting of K3 devices. Reviewed-by: Simon Glass <[email protected]> [[email protected]: fixed inconsist cert generation by multiple packing] Signed-off-by: Vignesh Raghavendra <[email protected]> Signed-off-by: Neha Malcom Francis <[email protected]>
2023-07-21binman: ti-board-config: Add support for TI board config binariesNeha Malcom Francis
The ti-board-config entry loads and validates a given YAML config file against a given schema, and generates the board config binary. K3 devices require these binaries to be packed into the final system firmware images. Reviewed-by: Simon Glass <[email protected]> Signed-off-by: Neha Malcom Francis <[email protected]>
2023-07-21Merge branch '2023-07-21-assorted-TI-platform-updates'Tom Rini
- The first half of a number of TI platform bugfixes and improvements, primarily around K3 platforms and splash screen support.
2023-07-21common: Kconfig: Fix CMD_BMP/BMP dependencySamuel Dionne-Riel
Using `default y` will not select BMP when CMD_BMP has been enabled, if it was already configured. By using `select`, if `CMD_BMP` is turned on, it will force the presence of `BMP`. Fixes: 072b0e16c4 ("common: Kconfig: Add BMP configs") Signed-off-by: Samuel Dionne-Riel <[email protected]> Signed-off-by: Nikhil M Jain <[email protected]>
2023-07-21doc: board: ti: am62x_sk: Add A53 SPL DDR layoutNikhil M Jain
To understand usage of DDR in A53 SPL stage, add a table showing region and space used by major components of SPL. Signed-off-by: Nikhil M Jain <[email protected]> Reviewed-by: Tom Rini <[email protected]>
2023-07-21configs: am62x_evm_a53: Add bloblist addressNikhil M Jain
Set bloblist address to 0x80D00000. Signed-off-by: Nikhil M Jain <[email protected]> Reviewed-by: Devarsh Thakkar <[email protected]>
generated by cgit v1.3.1 (git 2.54.0) at 2026-09-03 20:58:13 +0000