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This patch adds support for the ISSI IS25WP02GG QSPI NOR flash device.
Tested on the Versal VMK180
board in dual-parallel QSPI configuration.
Signed-off-by: jeffrey yu <[email protected]>
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This part is an FRAM, but can be used through the spi-nor generic code.
Signed-off-by: [email protected]
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Peng Fan (OSS) <[email protected]> says:
This patch set primarily removes unused DECLARE_GLOBAL_DATA_PTR
instances.
Many files declare DECLARE_GLOBAL_DATA_PTR and include
asm/global_data.h even though gd is never used. In these cases,
asm/global_data.h is effectively treated as a proxy header, which is
not a good practice.
Following the Include What You Use principle, files should include
only the headers they actually depend on, rather than relying on
global_data.h indirectly. This approach is also adopted in Linux kernel
[1].
The first few patches are prepartion to avoid building break after
remove the including of global_data.h.
A script is for filtering the files:
list=`find . -name "*.[ch]"`
for source in ${list}
do
result=`sed -n '/DECLARE_GLOBAL_DATA_PTR/p' ${source}`
if [ "${result}" == "DECLARE_GLOBAL_DATA_PTR;" ]; then
echo "Found in ${source}"
result=`sed -n '/\<gd\>/p' ${source}`
result2=`sed -n '/\<gd_/p' ${source}`
result3=`sed -n '/\<gd->/p' ${source}`
if [ "${result}" == "" ] && [ "${result2}" == "" ] && [ "${result3}" == "" ];then
echo "Cleanup ${source}"
sed -i '/DECLARE_GLOBAL_DATA_PTR/{N;/\n[[:space:]]*$/d;s/.*\n//;}' ${source}
sed -i '/DECLARE_GLOBAL_DATA_PTR/d' ${source}
sed -i '/global_data.h/d' ${source}
git add ${source}
fi
fi
done
[1] https://lpc.events/event/17/contributions/1620/attachments/1228/2520/Linux%20Kernel%20Header%20Optimization.pdf
CI: https://github.com/u-boot/u-boot/pull/865
Link: https://lore.kernel.org/r/[email protected]
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Remove DECLARE_GLOBAL_DATA_PTR from files where gd is not used, and
drop the unnecessary inclusion of asm/global_data.h.
Headers should be included directly by the files that need them,
rather than indirectly via global_data.h.
Reviewed-by: Patrice Chotard <[email protected]> #STMicroelectronics boards and STM32MP1 ram test driver
Tested-by: Anshul Dalal <[email protected]> #TI boards
Acked-by: Yao Zi <[email protected]> #TH1520
Signed-off-by: Peng Fan <[email protected]>
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In theory, for the same vendor, we should use the same instructions as
the spi-nor-core implementation.
Fixes: 72151ad10f8d ("mtd: spi-nor-core: Add Cypress manufacturer ID in set_4byte")
Fixes: 5bf3f3dd11db ("mtd: spi-nor: Enable QE bit for ISSI flash")
Signed-off-by: Shiji Yang <[email protected]>
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These chips are internally made of two/four dies with linear addressing
capabilities to make it transparent to the user that two/four dies were
used. There is one drawback however, the read status operation is racy
as the status bit only gives the active die status and not the status of
the other die. For commands affecting the two dies, it means if another
command is sent too fast after the first die has returned a valid
status (deviation can be up to 200us), the chip will get corrupted/in an
unstable state.
The solution adopted here is to iterate manually over all internal
dies (which takes about 30us per die) until all are ready. This approach
will always be faster than a blind delay which represents the maximum
deviation, while also being totally safe.
A flash-specific hook for the status register read had to be
implemented. Testing with the flash_speed benchmark in Linux shown no
difference with the existing performances (using the regular status read
core function).
As the presence of multiple dies is not filled in these chips SFDP
tables (the table containing the crucial information is optional), we
need to manually wire the hook.
This change is adapted from Linux.
Link: https://lore.kernel.org/all/20250110-winbond-6-12-rc1-nor-volatile-bit-v3-1-735363f8cc7d@bootlin.com/
Signed-off-by: Miquel Raynal <[email protected]>
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Some Winbond Flash chips share the same device ID. Names are not that
important for the SPI Flash, hence we don't need these duplicate ID
definitions. And the Flash size of w25q512jv is actually wrong. Clean
them up to keep the source file tidy.
Signed-off-by: Shiji Yang <[email protected]>
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The devm alloc functions that we have may follow the Linux kernel model
where allocations are (almost always) automatically free()'d. However,
quite often we don't enable, in full U-Boot, the tracking and free()'ing
functionality. This in turn leads to memory leaks because the driver
author expects that since the functions have the same name as in the
Linux Kernel they have the same behavior. In turn we then get
functionally correct commits such as commit 00e1fed93c8c ("firmware:
ti_sci: Fix memory leaks in devm_ti_sci_get_of_resource") that manually
add these calls. Rather than manually tracking allocations and
implementing free()s, rework things so that we follow expectations by
enabling the DEVRES functionality (outside of xPL phases).
This turns DEVRES from a prompted symbol to a symbol that must be
select'd, and we now remove our non-managed alloc/free functions from
outside of xPL builds.
Reviewed-by: Michael Trimarchi <[email protected]>
Signed-off-by: Tom Rini <[email protected]>
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All these chips are dual and quad capable. They are also DTR capable,
but the core is not yet ready for that.
Performances of all chips are comparable at 30MHz and are as follow:
Eraseblock single read speed: 938kiB/s
Eraseblock dual read speed: 1068kiB/s
Eraseblock quad read speed: 3751kiB/s
Signed-off-by: Miquel Raynal <[email protected]>
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When printing the contents of an size_t variable we need to use z prefix
to the format character in order to get the correct format type
depending on 32 or 64bit-ness.
Signed-off-by: Tom Rini <[email protected]>
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s25_s28_mdp_ready() returns 1 when spansion_sr_ready() returns negative
value (error code). Fix this problem by following Linux implementation.
Fixes: 1c3dd193b5b ("mtd: spi-nor-core: Add fixups for Cypress s25hl-t/s25hs-t")
Reported-by: Hiroyuki Saito <[email protected]>
Signed-off-by: Takahiro Kuwano <[email protected]>
Reviewed-by: Tudor Ambarus <[email protected]>
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Add IDs for Winbond W77Q51NW, 512M-bit Secure Serial Flash Memory
with Post-Quantum Cryptography, Dual/Quad SPI, QPI and DTR . The
flash part is similar to W25Q512NWM .
Signed-off-by: Marek Vasut <[email protected]>
Reviewed-by: Tudor Ambarus <[email protected]>
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Write enable(06h) command will be sent to a flash device to
set the write enable latch bit before every program, erase,
write command. After that write disable command (04h) needs
to be sent to clear the write enable latch.
This write_disable() is missing at the majority of the places
in the driver, add it to clear write enable latch.
Signed-off-by: Ashok Reddy Soma <[email protected]>
Signed-off-by: Venkatesh Yadav Abbarapu <[email protected]>
Link: https://gist.github.com/PrasanthBabuMantena/c12f39744de188a9d08cd5ca51dc2a7b
Tested-by: Prasanth Babu Mantena <[email protected]>
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MT35XU512ABA has only BFPT and 4-Byte Address Instruction Table
in SFDP. commit bebdc237507c ("mtd: spi-nor: Parse SFDP SCCR Map")
added checks in spi_nor_octal_dtr_enable() to bail out if the 22nd DWORD
in SCCR does not indicate DTR Octal Mode Enable, since MT35XU512ABA device
supports octal DTR mode, add this property in SFDP fixup.
Signed-off-by: Vaishnav Achath <[email protected]>
Signed-off-by: Prasanth Babu Mantena <[email protected]>
Reviewed-by: Udit Kumar <[email protected]>
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SST(sst26wf016) flashes have multiple erase block sizes, including
8 KB, 32 KB, and 64 KB. Since a 64 KB sector erase cannot be performed
on all blocks, the 4 KB sector erase command should be used instead.
Enabling the SPI_FLASH_USE_4K_SECTORS configuration allows the use of
4 KB sector erases, but it may increase the erase operation time for large
memory flashes.
This reverts commit 34cd4a72fb2d113e2754c0d643618a8e3fa549ab
MEMORY ORGANIZATION:
The SST26WF016B/016BA SQI memory array is organized
in uniform, 4 KByte erasable sectors with the following
erasable blocks: eight 8 KByte parameter, two
32 KByte overlay, and thirty 64 KByte overlay blocks.
See Figure 3-1.
Top of Memory Block
┌──────────┐
│ 8 KByte │
├──────────┤
│ 8 KByte │
├──────────┤
│ 8 KByte │
├──────────┤
│ 8 KByte │
├──────────┤
│ 32 KByte │
├──────────┤
│ 64 KByte │
├──────────┤
│ 64 KByte │
├──────────┤
│ 64 KByte │
├──────────┤
│ 32 KByte │
├──────────┤
│ 8 KByte │
├──────────┤
│ 8 KByte │
├──────────┤
│ 8 KByte │
├──────────┤
│ 8 KByte │
└──────────┘
Bottom of Memory Block
┌────────────────────────────────┐
│ 64 KByte │
├────────────────────────────────┤
│ 64 KByte │
└────────────────────────────────┘
Expanded View:
┌──────┐ ┌──────┐ ┌──────┐ ┌──────┐
│ 4 KB │ │ 4 KB │ │ 4 KB │ │ 4 KB │
├──────┤ ├──────┤ ├──────┤ ├──────┤
│ . . . (continues) . . . │
└──────┘ └──────┘ └──────┘ └──────┘
2 Sectors for 8 KByte blocks
8 Sectors for 32 KByte blocks
16 Sectors for 64 KByte blocks
Link: https://ww1.microchip.com/downloads/en/DeviceDoc/20005013D.pdf
Signed-off-by: Prasad Kummari <[email protected]>
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Takahiro Kuwano <[email protected]> says:
Those are 3.0V, 256Mb/2Gb NOR Flash devices with Octal interface.
Same fanctionalities with 1.8V version that are already supported.
Link: https://lore.kernel.org/r/[email protected]
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Infineon S28HL02GT is 3.0V, 2Gb Flash device with Octal interface.
It has the same functionalities with S28HS02GT.
Link: https://www.infineon.com/dgdl/Infineon-S28HS02GT_S28HS04GT_S28HL02GT_S28HL04GT_2Gb_4Gb_SEMPER_Flash_Octal_interface_1.8V_3.0V-DataSheet-v01_00-EN.pdf?fileId=8ac78c8c7e7124d1017f0631e33714d9
Reviewed-by: Tudor Ambarus <[email protected]>
Signed-off-by: Takahiro Kuwano <[email protected]>
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Infineon S28HL256T is 3.0V, 256Mb Flash device with Octal interface.
It has the same functionalities with S28HS256T.
Link:https://www.infineon.com/dgdl/Infineon-S28HS256T_S28HL256T_256Mb_SEMPER_Flash_Octal_interface_1_8V_3-DataSheet-v02_00-EN.pdf?fileId=8ac78c8c8fc2dd9c018fc66787aa0657
Reviewed-by: Tudor Ambarus <[email protected]>
Signed-off-by: Takahiro Kuwano <[email protected]>
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At the moment a mixture of ifdef(CONFIG_IS_ENABLED) and
CONFIG_IS_ENABLED(SPI_FLASH_BAR) is used in the spi-nor framework.
This leads to misbehaviour in the SPL as there is no Kconfig option
CONFIG_SPL_SPI_FLASH_BAR. This commit standardizes the use of
CONFIG_SPI_FLASH to get SPLs that load U-Boot proper from the
SPI flash to work again.
Fixes: 9bb02f7 (mtd: spi-nor: Fix the spi_nor_read() when config SPI_STACKED_PARALLEL is enabled)
Signed-off-by: Bernhard Messerklinger <[email protected]>
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Since the opcode SPINOR_OP_CHIP_ERASE (0xc7) is not supported
for the mt35xu01g/2g flashes, the NO_CHIP_ERASE flag has been added
to enable sector erase functionality instead.
Signed-off-by: Venkatesh Yadav Abbarapu <[email protected]>
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The SPI NOR code uses an implicit switch/case fallthrough when checking
different vendors to determine how to deal with extended addressig modes.
Add our "fallthrough;" statement-like macro before some label in the
4-byte addressing mode code, to avoid a warning when GCC's
-Wimplicit-fallthrough warning option is enabled.
Signed-off-by: Andre Przywara <[email protected]>
Reviewed-by: Tom Rini <[email protected]>
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Update the spi_nor_read() function based on the config SPI_FLASH_BAR
and update the length and bank calculation by spliting the memory of
16MB size banks only when the address width is 3byte.
Fix the read issue for 4byte address width by passing the entire
length to the read function.
Fixes: 5d40b3d384 ("mtd: spi-nor: Add parallel and stacked memories support")
Signed-off-by: Venkatesh Yadav Abbarapu <[email protected]>
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While we want to compile the SPI_STACKED_PARALLEL code everywhere we
can, it must first be guarded with an #if for DM_SPI as not all cases
where we have this code built, such as in SPL, will have the relevant
DM_SPI option enabled.
Fixes: 43423cdc5dc1 ("mtd: spi-nor: Always build SPI_STACKED_PARALLEL code")
Reviewed-by: Marek Vasut <[email protected]>
Signed-off-by: Tom Rini <[email protected]>
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Prevent the code gated by SPI_STACKED_PARALLEL from bitrot
by using if (CONFIG_IS_ENABLED(SPI_STACKED_PARALLEL)) around
it. That way, it is always at least compiled.
Fixes: 5d40b3d384dc ("mtd: spi-nor: Add parallel and stacked memories support")
Signed-off-by: Marek Vasut <[email protected]>
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The SPI_ADVANCE description does not explain what the switch does.
It does not have anything to do with any advanced functionality, it
only gates off support for stacked and parallel SPI NORs. Rename the
Kconfig symbol, update description, and move it right next to Xilinx
hardware as it seems to be specific to this hardware. Make sure the
symbol is also protected by if DM_SPI in Kconfig.
Fixes: 5d40b3d384dc ("mtd: spi-nor: Add parallel and stacked memories support")
Signed-off-by: Marek Vasut <[email protected]>
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Rewrite the code to make it clear exactly where the
SNOR_F_HAS_PARALLEL flag leads to *2 and /2 operation
compared to regular code path. No functional change.
Fixes: 5d40b3d384dc ("mtd: spi-nor: Add parallel and stacked memories support")
Signed-off-by: Marek Vasut <[email protected]>
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The offset variable is set, but never used afterward.
Fix indent. Fix predecrement without justification.
Remove use of parenthesis where unnecessary.
Fixes: 5d40b3d384dc ("mtd: spi-nor: Add parallel and stacked memories support")
Signed-off-by: Marek Vasut <[email protected]>
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Remove undocumented SST special case. This was added in commit
5d40b3d384dc ("mtd: spi-nor: Add parallel and stacked memories support")
without any explanation in the commit message. Remove it.
Fixes: 5d40b3d384dc ("mtd: spi-nor: Add parallel and stacked memories support")
Signed-off-by: Marek Vasut <[email protected]>
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Remove undocumented write_disable() call. This was added in commit
5d40b3d384dc ("mtd: spi-nor: Add parallel and stacked memories support")
without any explanation in the commit message. Remove it.
Fixes: 5d40b3d384dc ("mtd: spi-nor: Add parallel and stacked memories support")
Signed-off-by: Marek Vasut <[email protected]>
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Remove undocumented set_4byte() call. This was added in commit
5d40b3d384dc ("mtd: spi-nor: Add parallel and stacked memories support")
without any explanation in the commit message. Remove it.
Fixes: 5d40b3d384dc ("mtd: spi-nor: Add parallel and stacked memories support")
Signed-off-by: Marek Vasut <[email protected]>
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Remove undocumented spi_nor_wait_till_ready() call. This was added in commit
5d40b3d384dc ("mtd: spi-nor: Add parallel and stacked memories support")
without any explanation in the commit message. Remove it.
Fixes: 5d40b3d384dc ("mtd: spi-nor: Add parallel and stacked memories support")
Signed-off-by: Marek Vasut <[email protected]>
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Remove undocumented nor->addr_width == 3 test. This was added in commit
5d40b3d384dc ("mtd: spi-nor: Add parallel and stacked memories support")
without any explanation in the commit message. Remove it.
This also has a bad side-effect which breaks READ operation of every SPI NOR
which does not use addr_width == 3, e.g. s25fs512s does not work at all. This
is because if addr_width != 3, rem_bank_len is always 0, and if rem_bank_len
is 0, then read_len is 0 and if read_len is 0, then the spi_nor_read() returns
-EIO.
Basic reproducer is as follows:
"
=> sf probe ; sf read 0x50000000 0 0x10000
SF: Detected s25fs512s with page size 256 Bytes, erase size 256 KiB, total 64 MiB
device 0 offset 0x0, size 0x10000
SF: 65536 bytes @ 0x0 Read: ERROR -5
"
Fixes: 5d40b3d384dc ("mtd: spi-nor: Add parallel and stacked memories support")
Signed-off-by: Marek Vasut <[email protected]>
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Add SPI NOR flash id for mt35xu01gbba which supports 4 bytes address with
octal mode read.
Signed-off-by: Han Xu <[email protected]>
Signed-off-by: Alice Guo <[email protected]>
Reviewed-by: Peng Fan <[email protected]>
Reviewed-by: Jagan Teki <[email protected]>
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Added support for the Puya Semiconductor chips.
The datasheet can be found here:
https://www.puyasemi.com/h_xilie715.html
Signed-off-by: Dmitry Dunaev <[email protected]>
Reviewed-by: Jagan Teki <[email protected]>
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The Infineon SEMPER NOR flash family uses 2-bit ECC by default with each
ECC block being 16 bytes. Under this scheme multi-pass programming to an
ECC block is not allowed. Set the writesize to make sure multi-pass
programming is not attempted on the flash.
Acked-by: Tudor Ambarus <[email protected]>
Signed-off-by: Takahiro Kuwano <[email protected]>
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This patch follows the upstream linux commit:
5273cc6df984("mtd: spi-nor: core: Call spi_nor_post_sfdp_fixups() only
when SFDP is defined")
spi_nor_post_sfdp_fixups() was called regardless of if
spi_nor_parse_sfdp() had been called or not. late_init() should be
instead used to initialize the parameters that are not defined in SFDP.
Ideally spi_nor_post_sfdp_fixups() is called only after successful parse
of SFDP. However, in case SFDP support is disabled by .config, that can
break current functionality. Therefore, we would call it after
spi_nor_parse_sfdp() regardless of its return value.
Acked-by: Tudor Ambarus <[email protected]>
Signed-off-by: Takahiro Kuwano <[email protected]>
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default_init() is wrong, it contributes to the maze of initializing
flash parameters. We'd like to get rid of it because the flash
parameters that it initializes are not really used at SFDP parsing time,
thus they can be initialized later.
Ideally we want SFDP to initialize all the flash parameters. If (when)
SFDP tables are wrong, we fix them with the post_sfdp/bfpt hooks, to
emphasize that SFDP is indeed wrong. When there are parameters that are
not covered by SFDP, we initialize them in late_init() - these
parameters have nothing to do with SFDP and they are not needed earlier.
With this we'll have a clearer view of who initializes what.
There are six default_init() hooks implemented just for initializing
octal_dtr_enable() and/or setup() hooks that called later on.
Just moving those to late_init() does not change functionality.
Suggested-by: Tudor Ambarus <[email protected]>
Acked-by: Tudor Ambarus <[email protected]>
Signed-off-by: Takahiro Kuwano <[email protected]>
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The macronix_octal_fixups should be set only when mfr and flags match.
Fixes: df3d5f9e41 ("mtd: spi-nor: add support for Macronix Octal flash")
Acked-by: Tudor Ambarus <[email protected]>
Signed-off-by: Takahiro Kuwano <[email protected]>
Cc: JaimeLiao <[email protected]>
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Some flashes like the Infineon SEMPER NOR flash family use ECC. Under
this ECC scheme, multi-pass writes to an ECC block is not allowed.
In other words, once data is programmed to an ECC block, it can't be
programmed again without erasing it first.
Upper layers like file systems need to be given this information so they
do not cause error conditions on the flash by attempting multi-pass
programming. This can be done by setting 'writesize' in 'struct
mtd_info'.
Set the default to 1 but allow flashes to modify it in fixup hooks. If
more flashes show up with this constraint in the future it might be
worth it to add it to 'struct flash_info', but for now increasing its
size is not worth it.
This patch replicates the following upstream linux commit:
afd473e85827 ("mtd: spi-nor: core: Allow flashes to specify MTD writesize")
Acked-by: Tudor Ambarus <[email protected]>
Signed-off-by: Takahiro Kuwano <[email protected]>
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Simon Glass <[email protected]> says:
When the SPL build-phase was first created it was designed to solve a
particular problem (the need to init SDRAM so that U-Boot proper could
be loaded). It has since expanded to become an important part of U-Boot,
with three phases now present: TPL, VPL and SPL
Due to this history, the term 'SPL' is used to mean both a particular
phase (the one before U-Boot proper) and all the non-proper phases.
This has become confusing.
For a similar reason CONFIG_SPL_BUILD is set to 'y' for all 'SPL'
phases, not just SPL. So code which can only be compiled for actual SPL,
for example, must use something like this:
#if defined(CONFIG_SPL_BUILD) && !defined(CONFIG_TPL_BUILD)
In Makefiles we have similar issues. SPL_ has been used as a variable
which expands to either SPL_ or nothing, to chose between options like
CONFIG_BLK and CONFIG_SPL_BLK. When TPL appeared, a new SPL_TPL variable
was created which expanded to 'SPL_', 'TPL_' or nothing. Later it was
updated to support 'VPL_' as well.
This series starts a change in terminology and usage to resolve the
above issues:
- The word 'xPL' is used instead of 'SPL' to mean a non-proper build
- A new CONFIG_XPL_BUILD define indicates that the current build is an
'xPL' build
- The existing CONFIG_SPL_BUILD is changed to mean SPL; it is not now
defined for TPL and VPL phases
- The existing SPL_ Makefile variable is renamed to SPL_
- The existing SPL_TPL Makefile variable is renamed to PHASE_
It should be noted that xpl_phase() can generally be used instead of
the above CONFIGs without a code-space or run-time penalty.
This series does not attempt to convert all of U-Boot to use this new
terminology but it makes a start. In particular, renaming spl.h and
common/spl seems like a bridge too far at this point.
The series is fully bisectable. It has also been checked to ensure there
are no code-size changes on any commit.
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Use PHASE_ as the symbol to select a particular XPL build. This means
that SPL_TPL_ is no-longer set.
Update the comment in bootstage to refer to this symbol, instead of
SPL_
Signed-off-by: Simon Glass <[email protected]>
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Use the new symbol to refer to any 'SPL' build, including TPL and VPL
Signed-off-by: Simon Glass <[email protected]>
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Infineon S28HS256T is 256Mb Octal SPI device which has same
functionalities with 512Mb and 1Gb parts.
Link:https://www.infineon.com/dgdl/Infineon-S28HS256T_S28HL256T_256Mb_SEMPER_Flash_Octal_interface_1_8V_3-DataSheet-v02_00-EN.pdf?fileId=8ac78c8c8fc2dd9c018fc66787aa0657
Signed-off-by: Takahiro Kuwano <[email protected]>
Reviewed-by: Pratyush Yadav <[email protected]>
Reviewed-by: Tudor Ambarus <[email protected]>
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S28HS02GT is dual-die package parts and do not support chip erase.
Fixes: 16dd1095101 ("mtd: spi-nor-ids: Add Infineon(Cypress) s28hs02gt ID")
Reviewed-by: Tudor Ambarus <[email protected]>
Signed-off-by: Takahiro Kuwano <[email protected]>
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S25HL02GT and S25HS02GT are dual-die package parts and do not support
chip erase.
Fixes: c95a914aed7 ("mtd: spi-nor-ids: Add Cypress s25hl-t/s25hs-t")
Reviewed-by: Tudor Ambarus <[email protected]>
Signed-off-by: Takahiro Kuwano <[email protected]>
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[email protected] <[email protected]> says:
From: Takahiro Kuwano <[email protected]>
The S25FS064S, S25FS128S, and S25FS256S are the same family of SPI NOR
Flash devices with S25FS512S.
Datasheets:
https://www.infineon.com/dgdl/Infineon-S25FS064S_64_Mb_8_MB_FS-S_Flash_SPI_Multi-I_O_1-DataSheet-v10_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ed526b25412
https://www.infineon.com/dgdl/Infineon-S25FS128S_S25FS256S_1.8_V_Serial_Peripheral_Interface_with_Multi-I_O_MirrorBit(R)_Non-Volatile_Flash-DataSheet-v15_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ed6b5ab5758
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The S25FS064S, S25FS128S, and S25FS256S are the same family of SPI NOR
Flash devices with S25FS512S. Some difference depending on the device
densities are taken care in post SFDP fixup.
Signed-off-by: Takahiro Kuwano <[email protected]>
Reviewed-by: Pratyush Yadav <[email protected]>
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The 6th ID byte is needed to distiguish S25FL-S and S25FS-S families.
Signed-off-by: Takahiro Kuwano <[email protected]>
Reviewed-by: Pratyush Yadav <[email protected]>
Reviewed-by: Dhruva Gole <[email protected]>
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The correct 4KB erase opcode should be selected based on the address width
currently used.
Fixes: 562d166a13 ("mtd: spi-nor-core: Add fixups for s25fs512s")
Signed-off-by: Takahiro Kuwano <[email protected]>
Reviewed-by: Pratyush Yadav <[email protected]>
Reviewed-by: Dhruva Gole <[email protected]>
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The w25q16cl does support locking the same way w25q16dw does,
fill in the missing flags.
Signed-off-by: Marek Vasut <[email protected]>
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